Heltec Wireless Shell V3 LoRa Node Module (ESP32-S3 + SX1262)

Heltec

Heltec Wireless Shell V3 LoRa Node Module (ESP32-S3 + SX1262)

Name: Heltec Wireless Shell V3 LoRa Node Module (ESP32-S3 + SX1262)
Brand: Heltec
SKU: HT01011
Price: 22.95 EUR
Availability: InStock

SKU: HT01011

22,95 €

per pcs

incl. 19% VAT plus

Net: 19,29 €

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Available immediately

Delivery time: 3 - 4 weeks (DE - int. shipments may differ)

Product Information

Product safety information

Manufacturer information:

Heltec
Block B, Longtansi Steel Field, Chenghua District
Chengdu, China, 610052
[email protected]
https://eckstein-shop.de/Heltec-Marken

Responsible person:

Eckstein GmbH
Am Ostbahnhof 3
Niedersachsen
Clausthal-Zellerfeld, Deutschland, 38678
[email protected]
https://eckstein-shop.de

Dimensions and Weight
GTIN:	4060137097430
HAN:	HZ-HT01011
Category:	LoRa/ZigBee/XBee
Storage Tiers:	Neu
Shipping weight:	0,01 kg
Item weight:	0,01 kg
Dimensions ( Length × Width × Height ):	3,84 × 1,61 × 0,28 cm

Product Description

HTIT-Wsh(Wireless shell) is a long communication range, high receive sensitivity, low power consumption(9uA) and low cost LoRa node module. The HTIT-Wsh is composed up of an MCU (ESP32-S3FN8) and Semtech LoRa Transceivers (SX1262). 38.4 x 16.1 x 3.2(mm) size with 1.27mm stamp holes package makes it can be assembled into your PCB or products directly.

HTIT-Wsh is provide Wi-Fi, BLE and LoRa solution, perfectly support Arduino®. Users can easily carry out secondary development and application.

Main Features

CE Certificate
Microprocessor:ESP32-S3FN8 (Xtensa ® 32-bit LX7 dual core processor, five stage pipeline rack Structure, main frequency up to 240 MHz), with LoRa node chip SX1262
RF shielding (contain a shield shell) and other protection measures
Integrated WiFi, LoRa, Bluetooth network connections, both of them are IPEX socket
Support the Arduino development environment
(Exclusive) Supports the Arduino version of the ESP32 + LoRaWAN protocol routine provided by Heltec. This is a standard LoRaWAN protocol that can communicate with any gateway/base station running the LoRaWAN protocol (requires serial number activation, only the development of the company) The board is available, the serial number can be queried onthis page)
With good RF circuit design and basic low-power design (sleep current: 9uA theoretically), it is convenient for IoT application vendors to quickly verify solutions and deploy applications.

Specifications

Master Chip: ESP32-S3FN8 (Xtensa®32-bit lx7 dual core processor)
LoRa Node Chip: SX1262
Frequency: 863~928MHz
Max. TX Power: 21±1dBm
Max. Receiving Sensitivity: -139dBm
Wi-Fi: 802.11 b/g/n, up to 150Mbps
Bluetooth LE: Bluetooth 5, Bluetooth mesh
Hardware Resource
- 7*ADC1 + 8*ADC2
- 9*Touch
- 3*UART
- 2*I2C
- 2*SPI etc.
Interface
- LoRa ANT(IPEX1.0)
- 2.4G ANT (IPEX1.0)
- 1.27 spacing Stamp hole.
Operating Temperature: -40 ~ 85 ?
Dimensions: 38.4 * 16.1* 2.8 mm

Packing list

Wireless Shell x1

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Datasheet

Manufacturer according to GPSR
Heltec, Block B, Longtansi Steel Field, Chenghua District, 610052 Chengdu, China, [email protected], https://eckstein-shop.de/Heltec-Marken
Responsible person according to GPSR
Eckstein GmbH, Am Ostbahnhof 3, 38678 Clausthal-Zellerfeld, Niedersachsen, Deutschland, [email protected], https://eckstein-shop.de

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Heltec Wireless Shell V3 LoRa Node Module (ESP32-S3 + SX1262)

Dimensions and Weight

Heltec Wireless Shell V3 LoRa Node Module (ESP32-S3 + SX1262)

Service package

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