Block B, Longtansi Steel Field, Chenghua District
Chengdu, China, 610052
[email protected]
https://eckstein-shop.de/Heltec-Marken
Am Ostbahnhof 3
Niedersachsen
Clausthal-Zellerfeld, Deutschland, 38678
[email protected]
https://eckstein-shop.de
GTIN: | 4060137097560 |
HAN: | HZ-HT01037 |
Category: | LoRa/ZigBee/XBee |
Storage Tiers: | Neu |
Shipping weight: | 0,01 kg |
Item weight: | 0,01 kg |
Dimensions ( Length × Width × Height ): | 5,80 × 2,26 × 0,82 cm |
Heltec ESP32 Wireless Stick V3, LoRaWAN BLE Meshtastic, SX1262 LoRa node chip. On the basis of WiFi LoRa 32, it’s has a smaller size, 0.49? OLED display, and better RF characteristics.
Main Features
- Microprocessor: ESP32-S3FN8 (Xtensa® 32-bit LX7 dual core processor, five stage pipeline rack Structure, main frequency up to 240 MHz).
- SX1262 LoRa node chip.
- Type-C USB interface with a complete voltage regulator, ESD protection, short circuit protection, RF shielding, and other protection measures.
- Onboard SH1.25-2 battery interface, integrated lithium battery management system (charge and discharge management, overcharge protection, battery power detection, USB / battery power automatic switching).
- Integrated WiFi, LoRa, Bluetooth three network connections, onboard Wi-Fi, Bluetooth dedicated 2.4GHz metal spring antenna, reserved IPEX (U.FL) interface for LoRa use.
- Onboard 0.49-inch 64*32 dot matrix OLED display, which can be used to display debugging information, battery power, and other information.
- Integrated CP2102 USB to serial port chip, convenient for program downloading, debugging information printing.
- Support the Arduino development environment.
- We provide ESP32 + LoRaWAN protocol Arduino® library, this is a standard LoRaWAN protocol that can communicate with any LoRa gateway running the LoRaWAN protocol. In order to make this code running, a unique license is needed.
- With good RF circuit design and low-power design.
Specifications
- Master Chip: ESP32-S3FN8 (Xtensa®32-bit lx7 dual core processor)
- LoRa Node Chip: SX1262
- USB to Serial Chip: CP2102
- Frequency: 863~928MHz
- Max. TX Power: 21 ± 1 dBm
- Max. Receiving Sensitivity: -134dBm
- Wi-Fi: 802.11 b/g/n, up to 150Mbps
- Bluetooth: Bluetooth LE: Bluetooth 5, Bluetooth mesh
- Hardware Resource
- 7*ADC1 + 2*ADC2
- 7*Touch
- 3*UART
- 2*I2C
- 2*SPI
- etc.
- Display: 0.49-inch OLED
- Memory
- 384KB ROM
- 512KB SRAM
- 16KB RTC SRAM
- 8MB SiP Flash
- Battery: 3.7V lithium battery power supply and charging
- Operating temperature: -20 ~ 70 ?
- Dimensions: 58.08 * 22.6* 8.2 mm
- Interface
- Type-C USB
- 2*1.25 lithium battery interface
- LoRa ANT(IPEX1.0)
- 2*17*2.54 Header Pin
Packing list
- Wireless Stick x1
- Glue Rod Antenna x1
- SH1.25×2 Battery Connector x1
- Pin Map Sticker x1
Wiki
Manufacturer according to GPSR
Heltec, Block B, Longtansi Steel Field, Chenghua District, 610052 Chengdu, China, [email protected], https://eckstein-shop.de/Heltec-Marken
Responsible person according to GPSR
Eckstein GmbH, Am Ostbahnhof 3, 38678 Clausthal-Zellerfeld, Niedersachsen, Deutschland, [email protected], https://eckstein-shop.de