Block B, Longtansi Steel Field, Chenghua District
Chengdu, China, 610052
[email protected]
https://eckstein-shop.de/Heltec-Marken
Am Ostbahnhof 3
Niedersachsen
Clausthal-Zellerfeld, Deutschland, 38678
[email protected]
https://eckstein-shop.de
GTIN: | 4060137097515 |
HAN: | HZ-HT01024 |
Category: | LoRa/ZigBee/XBee |
Storage Tiers: | Neu |
Shipping weight: | 0,01 kg |
Item weight: | 0,01 kg |
Dimensions ( Length × Width × Height ): | 5,66 × 2,40 × 2,00 cm |
Based on ultra low power design, we launched LoRa Node 151, adopting the STM32L151CCU6 MCU (support DFU mode) and SX127x LoRa chip, use 1/2 AA Lithium chlorine sulfite battery. Enter low power mode under the standard LoRaWAN protocol, the Deep Sleep Current ? 1.8uA.
Main Features
- CE Certificate
- Microprocessor: STM32L151CBU6 (Ultra-low-power ARM Cortex-M3 MCU with 128 Kbytes Flash), with LoRa node chip SX1278 (433MHz ~ 510MHz)
- Onboard user resources available: 256 Kbytes of Flash memory with ECC 32 Kbytes of RAM 8 Kbytes of true EEPROM with ECC 128-byte backup register.
- Micro USB interface with a complete voltage regulator, ESD protection, short circuit protection, and other protection measures
- 1/2 AA battery shell, use 1/2 AA Lithium chlorine sulfite battery (this battery can’t charge, but onboard USB / battery power automatic switching allows connect USB when the battery is assembled)
- Reserve SMA antenna interface for LoRa use
- Download the firmware via DFU or ST-LINK
- Provide complete LoRaWAN(ClassA/C) source code(support ABP and OTAA)
- With good RF circuit design and basic low-power design (sleep current: 1.8uA), it is convenient for IoT application vendors to quickly verify solutions and deploy applications
Specifications
- Master Chip: STM32L151CBU6(Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3)
- LoRa Chipset: SX1278/SX1276
- Frequency: 863~928MHz
- Max. TX Power: 19 ± 1dBm
- Max. Receiving sensitivity: -135dBm
- Operating temperature: -20 ~ 70 ?
- Dimensions: 56.6 x 24 x 20 mm
- Interface
- Micro USB x 1
- LoRa Antenna interface(SMA) x 1
- 16 x 2.54 pin x 2 + 2 x 2.54 pin x 2
- Hardware Resource
- USART x 3
- SPI x 2
- I2C x 2
- I2S x 2
- 12-bits ADC input x 25
- 12-bits DAC output x 2
- GPIO x 29
- Memory
- 256KB internal FLASH
- 32KB internal SRAM
- Battery: 1/2AA Lithium
- Low Power: Deep Sleep 6uA
Packing list
- LoRa Node 151 x1
- Glue Rod Antenna x1
- pin map sticker x1
Wiki
Manufacturer according to GPSR
Heltec, Block B, Longtansi Steel Field, Chenghua District, 610052 Chengdu, China, [email protected], https://eckstein-shop.de/Heltec-Marken
Responsible person according to GPSR
Eckstein GmbH, Am Ostbahnhof 3, 38678 Clausthal-Zellerfeld, Niedersachsen, Deutschland, [email protected], https://eckstein-shop.de